1. 2. 3. material content data sheet sales product name ipp65r150cfda issued 29. august 2013 ma# MA001001680 package pg-to220-3-1 weight* 2039.90 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 11.566 0.57 0.57 5670 5670 leadframe non noble metal iron 7439-89-6 0.816 0.04 400 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 39.98 40.03 399693 400214 wire non noble metal aluminium 7429-90-5 2.542 0.12 0.12 1246 1246 encapsulation organic material carbon black 1333-86-4 8.851 0.43 4339 plastics epoxy resin - 97.366 4.77 47731 inorganic material silicondioxide 60676-86-0 483.877 23.72 28.92 237207 289277 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10521 10521 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder noble metal silver 7440-22-4 0.184 0.01 90 non noble metal tin 7440-31-5 0.147 0.01 72 non noble metal lead 7439-92-1 7.028 0.34 0.36 3445 3607 heatspreader inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal iron 7439-89-6 0.590 0.03 289 non noble metal copper 7440-50-8 589.466 28.90 28.94 288969 289345 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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